A Flexible Experimental Workcell for Efficient and Reliable Wafer-Level 3D Microassembly

This paper reports on an experimental microassembly workcell developed for efficient and reliable 3D assembly of large numbers of micromachined thin metal parts into micromachined holes in 4 inch silicon wafers. The major objective is to integrate techniques of microgripper design, microscopic imaging and high precision motion control to build a prototype system for industrial applications. The workcell consists of a multiple-view imaging system, a 4 DOF micromanipulator with high resolution rotation control, a large working space 4 DOF precision positioning system, a flexible microgripper, and control software system. A piezoelectric force sensing unit is developed to be integrated with the manipulator system to enhance pickup reliability. Operations are partially guided by a human operator through a graphical user interface (GUI). This system provides a highly flexible testbed for wafer-level 3D microassembly.